Up/down conversion / Phased array / Silicon timing

Air-Space-Ground Integrated RF Chip Supplier

We work deeply in customers’ real-world use scenarios and draw on in-house analog/RF IC capabilities to tailor production-ready chips with high integration and high performance.

Our Mission

Realizing every customer vision through exceptional chips.

Focused on RF, millimeter-wave, silicon timing and integrated sensing and communication, ZosTek delivers high-performance, reliable and manufacturable custom IC solutions.

Requirement First

Define IC targets from customer link budgets, system constraints and production goals.

Input
Link budget / system limits / cost targets
Method
Break down band, gain, noise, linearity and power limits
Output
Frozen IC targets and package constraints

System-Level Accountability

Coordinate modules, ICs, packaging and system validation to improve product performance.

Input
Module, IC, package and software constraints
Method
Joint simulation, prototype debug and EM/thermal closure
Output
Improved performance, reliability and testability

Production-Oriented Delivery

Close the loop from tape-out and testing to customer validation and production ramp.

Input
Tape-out, packaging, test and validation plans
Method
DFT/ATE, failure analysis, yield review and revision control
Output
Repeatable production package and delivery cadence

Products

Products

Core IC products for array systems, communication links and precision silicon timing. Each family can be delivered independently or integrated into customer systems.

Contact us

Phased-Array ICs

Array and beam control
01
Phased-Array ICs

Phase-shifting, attenuation control and beam-control IC solutions for Ka/K-band satellite communication arrays.

Models
ZTW29924 / ZTW29942
Public band
27.0-31.0 GHz
Control
6-bit phase control
Use
Ka/K phased arrays
Contact us

Up/Down-Conversion Transceivers

Wideband blocker-resistant receive
02
Up/Down-Conversion Transceivers

Receive-link solutions for Sub-6GHz 5G and IoT communication-sensing systems with blocker-resistant architecture.

Public scope
Blocker-resistant receive
Frequency
0.4-2.6 GHz
OOB rejection
53 dB
OOB IIP3
+15.4 dB
Contact us

Silicon Timing ICs

Low-jitter timing
03
Silicon Timing ICs

Frequency synthesis and multi-output synchronization solutions for optical and wireless communication equipment and stable timing systems.

Public scope
Precision silicon timing
System
Optical / wireless comms
Capability
Synthesis / sync
Metric note
Project data sheet required
Contact us

Custom Services

Custom Services

End-to-end custom services from IC definition to production ramp for high-frequency communication, low-altitude integrated sensing, satellite ground equipment and precision silicon timing.

01

System Requirement Breakdown

Define frequency, gain, noise, linearity, phase noise, power and package boundaries from link budgets and product constraints.

Output: System Requirement Document
02

Architecture and Process Selection

Select suitable CMOS/SOI, SiGe, GaAs or GaN processes to balance performance, cost and reliability.

Output: Architecture and process proposal
03

IC and Package Co-Design

Coordinate RF and millimeter-wave circuits, mixed-signal interfaces, SoC/SiP architecture, packaging and thermal constraints.

Output: GDS / package drawing / simulation report
04

Testing and Production Ramp

Support tape-out, packaging, test plans, failure analysis, customer validation and production introduction.

Output: test plan / production ramp report

Applications

Applications

Stable, precise and reliable timing and RF solutions for key future communication and sensing fields.

Contact

Contact Us

For sales inquiries, career submissions, technical materials or partnership discussions, please contact the corresponding team by email.

Sales and Product Inquiries

For chip products, solution selection, sample materials, custom design, business cooperation and early project discussions.

sales@zostek.comContact sales

Careers

For campus hiring, experienced hiring and role inquiries. Please include your resume or portfolio.

hr@zostek.comSend resume

Technical and Partnership Inquiries

For technical materials, sample evaluation, partnership discussions, media requests and company information.

info@zostek.comEmail team

Careers

Careers

Join us to advance RF and timing technology innovation.

Campus Hiring

Millimeter-Wave IC Design Engineer

RF IC designmmWaveHigh-frequency circuits

Work on millimeter-wave IC architecture, circuit design and simulation validation to improve performance and integration.

Responsibilities

  • Work on mmWave/phased-array IC architecture, circuit design and simulation.
  • Close key block targets, support layout co-design and debug test issues.
  • Coordinate with packaging, test and customer prototype validation.

Requirements

  • Background in microelectronics, IC design, communications or electromagnetics.
  • RF/mmWave circuit fundamentals and Cadence-based design flow experience.
  • Experience with PA/LNA, PLL, phased-array or high-frequency layout is preferred.
Apply by Email
Experienced Hiring

Millimeter-Wave IC Product Manager

Product planningMarket insightCross-team execution

Own market research, product planning and requirement definition for mmWave ICs from concept to production.

Responsibilities

  • Map demand across low-altitude, satellite internet and 6G terminal scenarios.
  • Define product specs, roadmap, competitive analysis and customer collateral.
  • Coordinate R&D, test and sales teams through sample validation and ramp.

Requirements

  • Background in electronics, communications, microelectronics or related fields.
  • Understanding of RF/mmWave IC products or communication system applications.
  • Strong product planning, customer communication and cross-team execution skills.
Apply by Email

Resume Submission

Send your resume to our recruiting mailbox. We look forward to hearing from you.

hr@zostek.com

About ZosTek

About ZosTek

ZosTek Technology (Suzhou) Co., Ltd. provides custom development and production delivery of RF and millimeter-wave ICs, phased-array ICs, frequency-conversion transceivers and silicon timing ICs for global civil system customers.

The team covers system design, IC design, semiconductor process selection and packaging technology, serving low-altitude economy, satellite internet ground terminals, communication equipment, industrial sensing, optical communication, wireless communication and servers.

Five capabilitiesProcess platforms, RF SoC/SiP, integrated sensing, multi-channel synchronization and high-speed mixed signal.
Four marketsLow-altitude systems, LEO ground equipment, 6G terminals, optical and wireless communication timing.
Integrated deliveryDefinition, design, tape-out, packaging, testing, validation and production introduction.